Exploring How Chip Packaging Shapes the Performance of Superconducting Quantum Processors

 Chii-Dong Chen

The way a quantum chip is packaged can greatly impact its performance by affecting temperature stability, protection from external radiation, signal clarity, and overall efficiency. In this presentation, I’ll share insights from our recent experiments, where we tested different chip package designs to understand their influence on key factors such as signal quality, temperature stability, and resistance to interference. We’ll also explore design strategies that could support the next generation of quantum chips with larger qubit arrays. This talk aims to shed light on the crucial role packaging plays in the future of quantum technology.